Conveners
Interconnect technology for future detector upgrades
- Mathieu Benoit (ORNL)
Reliable, cost-effective and scalable interconnects are essential for next-generation detectors. Within the CERN EP-R&D programme and the DRD3 and AIDAinnova collaborations, the University of Geneva and CERN (together with other research partners) have built a semiconductor assembly platform targeted to single-die processing. The platform unifies several bumping and bonding techniques,...
The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (»10 μm) with precision timing (<20 ps), while maintaining low power <1 W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely...
